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    News in Depth

    Nationwide Scholarship Program: top 186 out of 2700 selected
    Author: Ujwal Thapa, International Coordinator, Nationwide Scholarship Program
    Post Date: 7/24/2003
    Dear Members,

    We are delighted to inform that the The World Bank has chosen Nationwide Scholarship Program proposal " Doko Dai/Didi Project" as one of the 186 finalists out of a total 2700 proposals submitted. We would like to thank each and every member of the NSP team in Nepal and North America who worked ardently to make it to this level. In the coming months we will be asking for all you members help in making this proposal pass through the final round. Also if you are interested in contributing to this project, please email us at nsp@sebsonline.org or nspna@sebsonline.org in North America.

    sincerely,

    Ujwal Thapa
    International Coordinator
    Nationwide Scholarship Program


    here are the excerpts of what the World Bank sent us:
    (the email was referred to Priya 600B) who was the chief contact person for the NSP project)



    Proposal Title: Sustainable "Doko Dai" Mobile Library Project
    Proposal Number: 001684
    Sector: Education


    Dear Priyadarshani Joshi,

    Congratulations!

    We are pleased to inform you that your proposal has been selected as a finalist in the World Bank Development Marketplace Global Competition. This year, the
    Development Marketplace had a very competitive selection process. Of more than 2,700 submissions we received from over 133 countries, 186 (less than 10%) have
    reached the finalist round. Your proposal has already been reviewed by 6-9 assessors in two rounds of assessment, and now there is only one more round to go! Please refer to our website (www.developmentmarketplace.org) for a list of
    all finalists. From this group of finalists, we expect about 40 projects to be selected for funding.

    Please confirm your interest in going forward via email to
    dm2003finalist@worldbank.org no later than July 30, 2003. Make sure you
    reference your proposal title and number as provided at the beginning of this
    email. Please address all future correspondence to this email account.

    Once again, congratulations on reaching the finalist round of the DM2003
    competition.

    Best regards,


    The Development Marketplace Team
    The World Bank
    Washington, DC
    dm2003finalist@worldbank.org

     


     

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